Student Teacher
View Resource
  • Number of visits 83
  • Number of saves 12
  • Number of comments 15

Description

Overview:
This module describe about electronics application on IC manufacturing machines. Here, student will learn about machines in Front of Line (FOL) and End of Line (EOL) such as Wafer mounting, Die Attach/Bond, Wire Bond, 3rd Optical, Trimming, Moulding, Testing etc. 
Subject:
Engineering
Level:
College / Upper Division
Material Type:
Module
Author:
Date Added:
11/27/2017
License:
Creative Commons Attribution Non-Commercial No Derivatives
Language:
English
Media Format:
Downloadable docs

Comments

Nabil Akmal on Dec 02, 06:55pm

alhamdulillah done

Farid Iqbal on Dec 17, 08:16am

done

Henry Leow Chung Sun on Dec 15, 02:05am

done :)

Fadhlil Wafi on Dec 15, 01:54am

done

Asyraf Zainal on Dec 15, 01:54am

Done

edwin roch on Dec 15, 01:53am

done!!

Barrathy Vagananthan on Dec 15, 01:53am

done

Najwa Sabri on Dec 15, 01:53am

done

Syazwan Al-Hafiz on Dec 15, 01:53am

Done

Standards

No Alignments yet.

Evaluations

Achieve OER

Average Score (3 Points Possible)
Degree of AlignmentN/A
Quality of Explanation of the Subject Matter2.6 (7 users)
Utility of Materials Designed to Support Teaching2.7 (7 users)
Quality of Assessments2.7 (7 users)
Quality of Technological Interactivity2.3 (7 users)
Quality of Instructional and Practice Exercises2.7 (7 users)
Opportunities for Deeper Learning2.8 (8 users)

Tags (1)