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IC Packaging technology

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Description

Overview:
learning about  packaging for IC semiconductor from the die form until complete
Subject:
Engineering, Electronic Technology, Manufacturing
Level:
College / Upper Division
Material Type:
Module
Author:
Date Added:
11/27/2017
License:
Creative Commons Attribution-NonCommercial-NoDerivs 2.5 Malaysia Creative Commons Attribution-NonCommercial-NoDerivs 2.5 Malaysia
Language:
English
Media Format:
Downloadable docs, Graphics/Photos

Comments

*
Farid Iqbal on Dec 17, 08:15am

done

Henry Leow Chung Sun on Dec 15, 02:05am

done :)

Asyraf Zainal on Dec 15, 01:59am

Done review . Thank you

Fadhlil Wafi on Dec 15, 01:57am

done

Najwa Sabri on Dec 15, 01:57am

done review

Siti Nor Syuhadah on Dec 15, 01:56am

done

Syazwan Al-Hafiz on Dec 15, 01:56am

done

anis damia on Dec 15, 01:55am

done

Barrathy Vagananthan on Dec 15, 01:55am

done

edwin roch on Dec 15, 01:55am

Done!!

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Evaluations

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Average Score (3 Points Possible)
Degree of AlignmentN/A
Quality of Explanation of the Subject Matter3 (8 users)
Utility of Materials Designed to Support Teaching2.8 (8 users)
Quality of Assessments3 (8 users)
Quality of Technological Interactivity2.5 (8 users)
Quality of Instructional and Practice Exercises2.8 (8 users)
Opportunities for Deeper Learning2.7 (9 users)

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