Description
- Overview:
- learning about packaging for IC semiconductor from the die form until complete
- Subject:
- Engineering, Electronic Technology, Manufacturing
- Level:
- College / Upper Division
- Material Type:
- Module
- Author:
- Puteri Nadia Dayanie Megat Sabri
- Date Added:
- 11/27/2017
- License:
- Creative Commons Attribution Non-Commercial No Derivatives
- Language:
- English
- Media Format:
- Downloadable docs, Graphics/Photos
done
done :)
Done review . Thank you
done
done review
done
done
done
done
Done!!