Author:
Puteri Nadia Dayanie Megat Sabri
Subject:
Engineering, Electronic Technology, Manufacturing
Material Type:
Module
Level:
College / Upper Division
Tags:
  • Packaging
  • License:
    Creative Commons Attribution Non-Commercial No Derivatives
    Language:
    English
    Media Formats:
    Downloadable docs, Graphics/Photos

    IC Packaging technology

    IC Packaging technology

    Overview

    learning about  packaging for IC semiconductor from the die form until complete

    Activity 1

    a. Describe type of packaging.

    b. Briefly explain IC packaging.

    c. Difference through-hole  and surface mount technology.

     

    learning for packaging technology