- Author:
- Puteri Nadia Dayanie Megat Sabri
- Subject:
- Engineering, Electronic Technology, Manufacturing
- Material Type:
- Module
- Level:
- College / Upper Division
- Tags:
- License:
- Creative Commons Attribution Non-Commercial No Derivatives
- Language:
- English
- Media Formats:
- Downloadable docs, Graphics/Photos
Flow chart process for FOL and EOL
Process from test to finishing to QA
IC Packaging technology
Overview
learning about packaging for IC semiconductor from the die form until complete
Activity 1
a. Describe type of packaging.
b. Briefly explain IC packaging.
c. Difference through-hole and surface mount technology.
learning for packaging technology