Students are introduced to several key concepts of electronic circuits. They learn about some of the physics behind circuits, the key components in a circuit and their pervasiveness in our homes and everyday lives. Students learn about Ohm's Law and how it is used to analyze circuits.
Subject:
Mathematics and Statistics, Science and Technology
Physics, modeling, application, and technology of compound semiconductors (primarily III-Vs) in electronic, optoelectronic, and photonic devices and integrated circuits. Topics: properties, preparation, and processing of compound semiconductors; theory and practice of heterojunctions, quantum structures, and pseudomorphic strained layers; metal-semiconductor field effect transistors (MESFETs); heterojunction field effect transistors (HFETs) and bipolar transistors (HBTs); and optoelectronic devices.
This course introduces students to both passive and active electronic components (op-amps, 555 timers, TTL digital circuits). Basic analog and digital circuits and theory of operation are covered. The labs allow the students to master the use of electronic instruments and construct and/or solder several circuits. The labs also reinforce the concepts discussed in class with a hands-on approach and allow the students to gain significant experience with electrical instruments such as function generators, digital multimeters, oscilloscopes, logic analyzers and power supplies. In the last lab, the students build an electronic circuit that they can keep. The course is geared to freshmen and others who want an introduction to electronics circuits. This course is offered during the Independent Activities Period (IAP), which is a special 4-week term at MIT that runs from the first week of January until the end of the month.
Introduces the theory and technology of integrated-circuit fabrication. Lectures and laboratory sessions on basic processing techniques such as diffusion, oxidation, epitaxy, photolithography, chemical vapor deposition, and plasma etching. Emphasis on the interrelationships between material properties, device structure, and the electrical behavior of devices. Provides background for thesis work in microelectronics or for 6.151.
Introduces the theory and technology of integrated-circuit fabrication. Lectures and laboratory sessions on basic processing techniques such as diffusion, oxidation, epitaxy, photolithography, chemical vapor deposition, and plasma etching. Emphasis on the interrelationships between material properties, device structure, and the electrical behavior of devices. Provides background for thesis work in microelectronics or for 6.151. This course introduces the theory and technology of micro/nano fabrication. Lectures and laboratory sessions focus on basic processing techniques such as diffusion, oxidation, photolithography, chemical vapor deposition, and more. Through team lab assignments, students are expected to gain an understanding of these processing techniques, and how they are applied in concert to device fabrication. Students enrolled in this course have a unique opportunity to fashion and test micro/nano-devices, using modern techniques and technology.
Fundamental principles of the processes used in the fabrication of silicon monolithic integrated circuits. Physical models of bulk crystal growth, thermal oxidation, solid-state diffusion, ion implantation, epitaxial deposition, chemical vapor deposition, and physical vapor deposition. Refractory metal silicides, plasma and reactive ion etching, and rapid thermal processing. Process modeling and simulation. Technological limitations on integrated circuit design and fabrication. VLSI fundamentals.
Microelectronics has enabled designers of integrated circuits to exercise complete control over the electrical characteristics of each component they create. This unit will illustrate how such control is achieved and the various methods that can be applied in differing circumstances.
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